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Chamfering Machine

Fully-auto Wafer Chamfering Machine

Fully-auto Wafer Chamfering Machine has 2 processing axes, which can be controlled independently, or 1 axis can be pro-cessed separately.Compared with single-axis equipment,two-

axis equipment can increase processing efficiency by 70%.(Reference)

产品详情

Wafer Thickness     0.25-2.0mm
Applicable Size      4&6 inch、6&8 inch、12 inch
Axis     2 pcs independent control
Grinding Wheel Type     T type、R type、T&T type、T&R type
Grinding Wheel Size

     Thickness 20mm, OD 202mm, ID 30mm

     (Grinding wheel for Notch processing: OD 3mm)

Grinding Wheel Rev     Periphery 1,000~8,000m/min(frequency converting control)
Cutting Speed     Circumference 1~50mm/sec, Guide edge 1~20mm/sec
Obtainment of Technology     Advanced technology imported from Japan