✨ High Efficiency and Accuracy: Quickly removes impurities from the wafer surface,precisely controlling para-meters such as temperature, time, and chemical solution concentration to ensure the stability and consistency of cleaning, achieving uniform cleaning of the wafer surface and guaranteeing high-quality cleaning results.

✨ High Degree of Automation: The automated operation reduces manual intervention,improves production ef-ficiency, and also lowers the risk of misoperation. Simply select the appropriate cleaning mode according to differ-ent cleaning needs, place the wafers in the cleaning machine, and start the cleaning program. The machine also features a drying function for convenient subsequent processing.

✨ Cost Reduction: The filtration system helps extend the service life of chemical solutions, reducing operating costs.

✨ High Work Efficiency: Equipped with multiple robotic arms operating simultaneously,it offers high efficiency and stability.

✨ High Safety: Equipped with leakage protection, liquid leakage protection,temperature protection, electrosta-tic discharge devices, and a fully automatic fire suppression system to ensure the safety of the equipment during operation.