The fully automatic trough cleaning equipment owns multiple independent intellectual property rights and can be applied to RCA cleaning process, wet etching process,metal layer wet etc-hing process,furnace tube pre-cleaning process and other spe-cial process cleaning needs.The equipment adopts modular de-sign and is easy to maintain.
✨ Equipped with real-time monitoring of drug concentration and efficient recovery system, improving the utiliz-ation rate of drug solution
✨ It can be equipped with ultrasonic,megawave and tank flow field control technology to optimize cleaning ca-pability
✨ Flexible design,automatic scheduling of the system, multi-station concurrent processing,achieving efficient o-peration
✨ Software and hardware interlock safety device,automatic temperature calibration and over-temperature prot-ection to ensure the safety of personnel and machine
✨ It can be paired with functions such as one click acid change and Auto Pm to improve machine maintenance efficiency
✨ Multiple sets of robotic arm systems are transmitted to support the demand for "dry in, dry out" and improve cleanliness requirements
Applicable Process | Wafer Clean,Etch,PR Strip |
Applicable Size | 4/6/8/12 inch |
Handing Method | Standard Cassette、Loadport |
Process Indicators | Surface Particles:≤300pcs/wafer -@0.1-0.2μm Small Particle 表 面颗粒:≤5-10pcs/wafer @0.3μm Particle Metal Residue:≤5E10 atoms/cm² |
Software Support | GEM/SECS interface,which provides functions such as EAP,MES etc. |