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Single-Wafer Wet Process Eqpt.

Fully-auto Seed Wafers Brushing Machine

Fully-Auto Seed Wafers Brushing Machine can effectively remo-ve the remaining physical particles on the wafer through the ro-tating brush head and two fluids, combined with DIW.It is mainly used for cleaning seed wafers of different specs.


产品详情

✨ Compatible with 6-12 inch multi-specs wafers

✨ Self-cleaning brush head

✨ Independent flipping module, automatic flipping and cleaning of both sides of the wafer

✨ Accurate alignment of multi-specs wafers

✨ Excellent cleaning results

✨ A variety of safety tests(avoiding Debris producing)


Applicable Process     Mask Clean
Applicable Size     4&6 inch,6&8 inch
Loadport type     Open Cassette
Chemicals     ACE/NMP/EKC/IPA
Particle     ≤30ea @0.2μm
Frangementation Rate     ≤0.1‰