Fully-Auto PR Removal Washing Machine can effectively remove the photoresist on the wafer surface or peel off the metal film and clean the wafer surface through immersion, high-pressure cleaning, ACE/IPA rinsing and mega cleaning.
The equipment is mainly composed of soaking chamber, deglu-ing(stripping)chamber, cleaning and drying chamber, lifting sca-nning swing arm module, loading and unloading table module, centering module, high-pressure liquid supply system, atmosph-eric pressure liquid supply and discharge system, air purification and static elimination system, safety and fire protection system, central control system, etc. The process chamber can be equipp-ed with high-pressure organic degumming, atmospheric organic cleaning, megasound cleaning, IPA cleaning, nitrogen purging, centrifugal spinning and other functions.
✨ Compatible with a wide range of wafer sizes
✨ Controllable high-pressure PR removal (stripping) technology
✨ Dry in and dry out processing mode
✨ Trough immersion tank, stable and efficient
✨ Chemical fluid recycling
✨ Precious metals collecting and recycling
Applicable Process | Lift-Off,PR Strip |
Applicable Size | 4&6 inch,6&8 inch,8&12 inch |
Loadport type | Open Cassette,FOUP,SMIF |
Chemicals | ACE/NMP/EKC/IPA |
Particle | ≤30ea @0.2μm |
Frangementation Rate | ≤0.1‰ |