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Single-Wafer Wet Process Eqpt.

Fully-auto PR Removal Washing Machine

Fully-Auto PR Removal Washing Machine can effectively remove the photoresist on the wafer surface or peel off the metal film and clean the wafer surface through immersion, high-pressure cleaning, ACE/IPA rinsing and mega cleaning.

The equipment is mainly composed of soaking chamber, deglu-ing(stripping)chamber, cleaning and drying chamber, lifting sca-nning swing arm module, loading and unloading table module, centering module, high-pressure liquid supply system, atmosph-eric pressure liquid supply and discharge system, air purification and static elimination system, safety and fire protection system, central control system, etc. The process chamber can be equipp-ed with high-pressure organic degumming, atmospheric organic cleaning, megasound cleaning, IPA cleaning, nitrogen purging, centrifugal spinning and other functions.

产品详情

 Compatible with a wide range of wafer sizes

 Controllable high-pressure PR removal (stripping) technology

 Dry in and dry out processing mode

 Trough immersion tank, stable and efficient

 Chemical fluid recycling

 Precious metals collecting and recycling


Applicable Process     Lift-Off,PR Strip
Applicable Size     4&6 inch,6&8 inch,8&12 inch
Loadport type     Open Cassette,FOUP,SMIF
Chemicals     ACE/NMP/EKC/IPA
Particle     ≤30ea @0.2μm
Frangementation Rate     ≤0.1‰